Abstract The hollow cathode will be presented as a plasma source for reactive evaporation processes. The hollow cathode generates an arc discharge plasma. This contains a high portion of directed electrons with an enhanced mean energy, the... Abstract
The hollow cathode will be presented as a plasma source for reactive evaporation processes. The hollow cathode generates an arc discharge plasma. This contains a high portion of directed electrons with an enhanced mean energy, the so called low voltage electron beam (LVEB). The mean energy of the LVEB, in the range of 11 eV, results in a very effective ionization of the gas and vapor particles.
Consequently, very high plasma densities can be achieved, which corresponds to high particle densities in high-rate deposition processes.
Furthermore, a high self bias potential of about 16 V is obtained on insulating substrates. For the coating of heat-sensitive substrates with high deposition rates a process with a low ratio between thermal load and deposition rate is necessary. The heat flux on plastic substrates 2 has been measured at the reactive Al evaporation process. The overall thermal load of about 4 W/cm related to a deposition rate of 100nm/ s is low in comparison to other processes. This makes the hollow cathode a favorable tool for the plasma-activated high-rate
deposition. The oxide layers deposited by this process show dense and glassy structures even at comparatively low condensation 2 temperatures. This is caused by the high ion current densities in the order of 30 mA/ cm . The low ion energy determined by the self bias potential results in relatively low compressive stress below 100 MPa. The low thermal load and the moderate intrinsic stress of the layers makes the hollow cathode plasma-activated deposition (HAD) process the method of choice for the deposition of oxides as abrasion resistant layers on plastic films and sheets. Ó 1998 Elsevier Science S.A. All rights reserved.
1. Introduction
Table 1 shows typical layer materials that have been
deposited by the PMS–DMS process and the corre-In recent years, the importance of coating plastic sponding dynamic deposition rates. The dynamic deposisurfaces with oxides and nitrides has increased. Typical tion rate is defined for moving substrates as the product of applications are solar control and low-emissivity multilayer the layer thickness and the substrate transportation speed.
systems for window panes and window films, antiabrasion The HAD (hollow cathode-activated deposition) process layers on plastic films, plastic sheets and plastic parts as is the combination of a high-rate evaporation process and a well as barrier layers for packaging films. high-density plasma activation using the hollow cathode
2022年2月23日,国家高分子材料质量检验检测中心(安徽)与珀金埃尔默合力共建的联合实验室——高分子材料检
Before fractionation on a semi-preparative scale, we
Abstract: To isolate anti-salt stress genes from man
http://hi.baidu.com/lyl464797826/blog/item/0c12e646ec
Precious metals are found in the process and wastewat
拉曼散射技术是血液中的生物标记物化验领域出现的新的独特的工具,它能提供特征的化学“指纹”,具有低
KeywordsCarbondioxide.SupercriticalfluidExtraction.Ca
书上是这样说的:高分子链之间通过化学键或链段连接成一个三维空间网状大分子即为交联高分子。我想问一下,通过“
常见的天然材料,合成材料,有机高分子材料,合成纤维,分别举4个例子吧,谢谢... 常见的天然材料,合成
[报告简介]透射电子显微镜(TEM)能够以极高的空间分辨率,观察样品的精细结构,从而广泛用于材料科学、以及纳