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Evaporation is a powerful technique for thick metal or organic coatings. It is a vapor phase deposition technique and requires good vacuum. High temperatures must be reached to vaporize the material under vacuum to coat the substrate. Typically any material where evaporation temperature is less than 2000 0C can be evaporated at about 10-5 Torr for coating. However, appropriate crucibles (Alumina, Quartz, Boron Nitride etc) with proper baskets or boats must be chosen. Organic materials require lower temperatures (about 6000C) but better controlled.
Some materials have low sticking coefficient making it difficult to build a film or require substrate heating (optional) to control stoichiometry. These problems can be overcome by pressure and heating control. Having a computer-controlled system we can assure low background pressure is reached before evaporation can start. Especially at the beginning, impurities that outgas can be pumped down by heating the empty crucible or the boat.

In order to make the most effective use of your thin film deposition system; it is necessary to understand some of the basic parameters involved in creating thin films using the plasma source. Plasma deposition systems typically consist of a parallel plate configuration where the upper electrode is RF and the lower electrode is ground. Gas comes through the showerhead. In such configuration activating two species with substantially different activation energy is difficult, and both stoichiometry and thickness can not be uniform over large substrate areas. Here the secondary gas input line allows difficult to activate species to enter plasma from the source and easier to activate species are provided at a through the primary line of the source. Then best uniformity can be achieved by optimizing flows at different pressures.
 
It is imperative that a deep base pressure be achieved in order to get the adhesion and cleanliness necessary for high quality thin film deposition.  The lowest RF power at which discharge can be initiated depends on the type of gas used; however typically these pressures are around 0.1 Torr. RF power can be increased when auto tuning is capable of real time tuning with reflected powers in the range of 1% of total. At high powers, the plasma may display instabilities, which may be removed by increasing pressure. At lower pressures more uniform and diffused plasma can be obtained at lower power levels. Typical operational pressure range is 0.1 to 1 Torr, 100-200W. Below is a graph of the operating power limits for the plasma source. Any values in the shaded region should produce consistent plasma.
 
 
Uniformity of the deposition would be function of the flow rates, substrate temperature and the spacing between the electrodes. The substrate can be heated to a maximum 400C.
 
Biasing the platen can control ion acceleration energy through the plasma sheet. Plasma potential can also be affected by controlling electron loss through the plasma. Therefore, through biasing and heating, denser and harder films can be produced.

In order to make the most effective use of your thin film deposition system, it is necessary to understand some of the basic parameters involved in creating thin films. The deposition process can be broadly classified into physical vapor deposition ( PVD ) and chemical vapor deposition ( CVD ). In CVD , the film growth occurs at higher temperatures leading to the development of corrosive gaseous products and might leave impurities on the film. The PVD process can be performed at lower deposition temperatures also leaving corrosive products aside, but deposition rates are lower and it leaves residual compressive stress in the film. Electron beam physical vapor deposition, nevertheless, yields a high deposition rate from 0.1 μm / min to 10 μm / min at relatively low substrate temperatures, with very high material usage efficiency. Due to the very high deposition rate, this process has industrial applications for wear resistant and thermal barrier coatings in aerospace industries, hard coatings for cutting and tool industries, and electronic and optical films for semiconductor industries. In principle, solid evaporant such as powder, granules, lumps, or shaped plug, is placed in the source's copper hearth or in a hearth-liner. A high electron flux produced by hot filament positioned beneath the source is extracted and electro statically and magnetically bent/focused on the top of the evaporant. The electron beam's energy elevates the evaporant's surface temperature. Seldom is the beam rastered to increase the evaporation region. Since the evaporation region is enclosed by cooler (often solid) evaporant, unlike other thermal sources, the e-beam source's vapor plume is chiefly uncontaminated by crucible material. Production scale e-beam sources are usually single pocket (one hearth). Multipocket source (4 or 6 hearths) is available for R & D applications. A cover plate obscures the pockets "not-in-use" to prevent vapor cross talk. Multipocket sources are particularly convenient when depositing multilayer films on a single substrate.

美国Thermal Technology公司（简称TT），是真空炉的创shi者，高温炉设计的改造者。从创立至今已有半个多世纪的历史，在40多个国家拥有超过3000多家用户。TT公司具有丰富的专业经验，在高温加工技术领域一直享有盛誉。

Quantum Design公司作为知名的科学仪器制造商，现全面引进TT公司高温炉。TT公司生产的高温设备有：放电等离子烧结炉（SPS）、直流型等离子烧结炉(DCS)、热压炉(HPF)、自动热处理炉(APF)、陶瓷热处理炉(CPF)、电弧炉(AMF)、石墨高温炉(GHZ)、金属高温炉（MHZ）等。此外，TT公司可根据顾客需求提供创新性的设备和问题解决方案。

放电等离子烧结炉 SPS

只需几分钟即可达到热处理所需的高温环境

快速成型且无需粘结剂，微纳结构wan美保持

直流型等离子烧结炉 DCS

直流电源，系统简单，高稳定性

更短的加工时间，更低的成本

热压炉 HPF

交换式热区单元选件，可用热区：石墨、钨、钼

电弧炉 AMF

Z高温度：＞3000℃

石墨高温炉

适用于各种实验室应用及小规模生产

Z高可定制温度达3000℃

金属高温炉

适用于各种实验室应用及小规模生产

Z高可定制温度达3000℃

TT的高温炉在设计上采用了du家ZL的加热系统以及Z好的液压、真空和控制系统，对技术和制造工艺的精益求精，使得TT产品具有高质量、高可靠性的特点。希望Quantum Design公司的高精度物性测量和表征平台和TT公司的高质量高温炉系统可以相辅相成，相互促进，为ZG科学工作者提供更好的服务。

相关产品

TT 自动热处理炉 / 陶瓷热处理炉：http://www.qd-china.com/products2.aspx?id=332

TT 电弧熔炼炉：http://www.qd-china.com/products2.aspx?id=333

TT 实验室真空高温炉：http://www.qd-china.com/products2.aspx?id=334

TT 放电等离子烧结炉（SPS/DCS）：http://www.qd-china.com/products2.aspx?id=335

TT 热压炉：http://www.qd-china.com/products2.aspx?id=336

关于Quantum Design

Quantum Design是世界lingxian的科研设备制造商和仪器分销商，于1982年创建于美国加州圣迭戈。公司生产的 SQUID 磁学测量系统 (MPMS) 和材料综合物理性质测量系统 (PPMS) 已经成为世界公认的ding级测量平台，广泛的分布于世界上几乎所有材料、物理、化学、纳米等研究领域的实验室。2007年，Quantum Design并购了欧洲Z大的仪器分销商LOT公司，现已成为世界的科学仪器领域的跨国公司。目前公司拥有分布于英国、美国、法国、德国、巴西、印度，日本和ZG等地区的数十个分公司和办事处，业务遍及一百多个国家和地区。ZG地区是Quantum Design公司Z活跃的市场，公司在北京、上海和广州设有分公司或办事处。几十年来，公司与ZG的科研和教育领域的合作卓有成效，为ZG科研的进步提供了先进的设备以及高质量的服务。