德国EBAC/RCI电子束吸收电流分析系统

尚丰科技向用户提供专业的的电子束吸收电流分析系统EBAC/RCI
 
EBAC/RCI原理

EBAC/RCI电子束吸收电流分析系统，能够方便快速的定位半导体芯片电路中的短路及失效点位置，不但可以对同层电路，而且可以对次表层，甚至表层下第三层、第四层电路进行失效点的精确定位，因此能够对半导体芯片电路或相关材料进行快速准确的失效分析。

目前，集成电路芯片设计越来越复杂，关键尺寸和金属连线线宽越来越小，传统的失效点定位方法，如微光显微镜或光束又到电阻变化鞥，由于其分辨率不足，导致不能精确地定位电路故障点位置，电压衬度方法虽然在一些开路短路失效分析中能快速地定位失效点，但只是局限于电路同层分析。

EBAC/RCI电子束吸收电流分析系统是基于扫描电镜的分析系统，在保留扫描电镜高分辨率的前提下，能够对同层芯片电路进行高准确定位，同时能够对次表层甚至表面下第三、第四层电路进行失效点定位，因此越来越多的应用于先进制程芯片的失效分析。在涉及多层金属层的失效定位分析时，EBAC/RCI方法更加简便精确，可保证分析的成功率，并缩短分析周期。

EBAC/RCI acquisition

The lowest noise Electron Beam Absorbed Current (EBAC)
and Resistive Contrast Imaging (RCI)   

Find exact location of any open,resistive or shorting defect
 

• Localize metal line cuts caused by cracking,corrosion, electro-migration, or foreign particles

• Identify resistive opens caused by interface contamination at via interconnects

• Pinpoint location for direct TEM lamella FIB preparation 

Characterize interconnects with highest resolution
 

• Reveal electrical integrity of nets with sub-mciron lateral resolution and bridge from EFA to PFA

• Diagnose fabrication and long term issues, including contamination,metal pattering defects, resistive interconnectors, or electro-migration

• Directly isolate defects to the exact layer and die location, and improve them to product improvement actions
   

Verify device operation modes with built-in biasing for voltage contrast

• Image bias/voltage contrast in delayered devices

• Monitor operation of devices under bias

• Compare imaged behaviour with device design

Localize defects in thin dielectric layers 

• Visualise and localise weaknesses in gate oxide (GOX) and capacitor oxide (COX) before breakdown

• Pinpoint oxides shorts caused by ESD or EOS with sub-micron resolution

• Preserve the original defect signature with power dissipation in the lower nW range during localization

Access failures invisible in voltage contrast

• Find low resistances that allow charge tunneling trough the interconnects

• Investigate structures in contact with the silicon substrate

• Characterize large metal structures

尚丰科技致力于引进推广先进的材料、生物显微观测及微区分析仪器，向科研人员提供高附加值服务。

我们拥有一支涉及众多领域高素质的应用支持团队，为各行业的应用需求提供专业的解决方案和售后服务。

敬请联络